BONDCHECK

The BONDCHECK is a flaw detection device for composites that uses multiple inspection modes. It allows for inspection using either the "Pitch-Catch" mode, the "Resonance" mode, or the "MIA: Mechanical Impedance Analysis" mode. The Bondcheck enables fast inspections with excellent defect sensitivity.

All functions and all modes are combined in a single lightweight and standalone device. User interface common to all three modes, Simple and Intuitive.

• Multimode device
• Single calibration for quick and easy setups
• Lightweight and portable
• Probes with Pitch-Catch and MIA coupling
• Automatic optimization of inspection frequency
• Ideal for inspection of bonds, honeycomb composites, and complex structures
• 2-year warranty